MojoKid writes: Qualcomm provided a deep-dive view today of its Snapdragon 845 mobile processor platform that it recently announced, highlighting key advancements in what the company is referring to as a completely new silicon design. The new chip now employs a Kyro 385 CPU with four high performance cores at 2.8GHz (25 percent faster than the previous gen Snapdragon 835) and four “efficiency” cores operating at 1.7GHz. The new chip also includes the new Spectra 280 image signal processor (ISP). Compared to its predecessor, the image signal processor (ISP) in the Snapdragon 845 promises a 64x uplift in the ability to capture high dynamic range (HDR) color information for 4K HDR video capture and playback. The chip’s new Adreno 630 GPU promises a 30 percent boost in gaming performance compared to its predecessor, along with room-scale VR/AR experiences that support 6 degrees of freedom along with simultaneous localization and mapping, or SLAM. Finally, the new SoC platform incorporates Qualcomm’s second-generation gigabit LTE modem: the Snapdragon X20. This Cat 18 modem supports peak download speeds of 1.2Gbps along with 5x carrier aggregation, 4×4 MIMO, and Dual SIM-Dual VoLTE. Qualcomm says that the first Snapdragon 845 processors will begin shipping in production devices in early 2018.
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